Posted by New Delhi: The Union Cabinet has approved semiconductor manufacturing units in three states – Odisha, Punjab and Andhra Pradesh as part of four new projects under the India Semiconductor Mission (ISM), with a combined investment of ₹4,600 crore.
The Union Cabinet under the chairmanship of Prime Minister Narendra Modi cleared proposals from SiCSem, 3D Glass Solutions Inc., Continental Device India Private Limited (CDIL), and Advanced System in Package (ASIP) Technologies. These projects are expected to create over 2,000 skilled jobs and strengthen India’s position in the semiconductor sector.
SiCSem and 3D Glass Solutions will set up facilities in Info Valley, Bhubaneshwar. SiCSem, in collaboration with Clas-SiC Wafer Fab Ltd., UK, will build India’s first commercial compound semiconductor fab to produce Silicon Carbide devices. The facility will have an annual capacity of 60,000 wafers and 96 million packaged units for use in defence, electric vehicles, railways, fast chargers and solar inverters.
3D Glass Solutions will establish a packaging and embedded glass substrate unit, introducing advanced technologies such as glass interposers, silicon bridges and 3D Heterogeneous Integration modules. The facility’s output will include 69,600 glass panel substrates, 50 million assembled units and 13,200 3DHI modules annually, with applications in defence, AI, automotive and photonics.
ASIP Technologies will open a manufacturing unit in Andhra Pradesh with technology support from APACT Co. Ltd, South Korea. The unit will produce 96 million semiconductor units annually, used in mobile phones, set-top boxes and automotive electronics.
CDIL will expand its semiconductor facility in Mohali, Punjab, manufacturing high-power devices such as MOSFETs, IGBTs and diodes in both silicon and silicon carbide. The facility will have a capacity of 158.38 million units per year, supporting applications in renewable energy, industrial electronics and EV infrastructure.
“With the approval of these projects, semiconductor ecosystem in country would get significant boost as these projects include country’s first commercial compound fab as well as highly advanced glass-based substrate semiconductor packaging unit,” said the government in a press statement.
These approvals bring the total number of projects under the India Semiconductor Mission to 10, with a combined investment of ₹1.60 lakh crore across six states.