Bangalore: Swedish networking and telecommunications company, Ericsson to expand its Research and Development (R&D) team in India with over 150 positions.
Ericsson is expanding its Research and Development (R&D) team in Bengaluru, to enhance its capabilities in Application-Specific Integrated Circuit (ASIC) development. It expects to initially grow its R&D team in India by more than 150 positions, according to a press release.
Ericsson said its decision to expand its R&D presence in Bengaluru, shows its dedication to fostering innovation in the highly competitive field of ASIC development.
“Expanding our ASIC R&D in India will enable us to leverage the local technology competence in the country towards enhancing our capabilities in semiconductor design. This unit will also contribute towards strengthening the semiconductor ecosystem in the country. Ericsson expects to initially grow its R&D team in India by more than 150 positions,” said Nitin Bansal, MD of Ericsson India.
“We are keen to strengthen our R&D team in Bengaluru, a city celebrated for its dynamic technology ecosystem and skilled professionals. By increasing our focus on ASIC development, we are reinforcing our technological prowess,” said Anna Dicander, VP of Radio and Transport Engineering, Ericsson Business Area Networks.
Our investments in the Ericsson Silicon platform, in particular, will accelerate the launch of new products and innovative features to the market,” added Dicander.
The Stockholm headquartered company said its R&D expansion in India will serve to enhance Ericsson’s industry-leading portfolio, shaping the future with high-performing programmable networks.
For more than 120 years, Ericsson has been instrumental in shaping India’s telecom landscape, including mobile connectivity. From laying the groundwork for GSM services in 1994 to supporting the 5G evolution to launching its India 6G programme in 2023 with the formation of an India 6G Research Team at the company’s Chennai R&D Centre.
“Ericsson Silicon plays a crucial role in creating high-performing, energy-efficient, and lightweight products suitable for various deployment scenarios,” Dicander added.
