Posted by Bangalore: Lam Research announced the Syndion GP solution that aims to help chipmakers meet the demand for advanced power devices.
The new Syndion GP solution provides deep silicon etch capabilities to chipmakers developing the latest power devices and power management integrated circuits. The automotive, electric power delivery and energy industries largely use these devices and circuits.
The technology needs of these sectors over the past many years have become more advanced. This has increased the demand for higher power, improved performance and greater density at the chip level.
To meet such specific capabilities, silicon chipmaking requires greater cross-wafer uniformity for higher aspect-ratio structures.
Moving to an advanced device structure would help not to alter the form factor and achieve those enhancements. To do that, device manufacturers need a very precise and uniform deep silicon etch process.
Syndion GP’s design support this precision manufacturing process, according to Lam Research Its design enables a simplified transition path to increased capacity and chipmakers can configure Syndion GP to manufacture devices at 200 mm and 300 mm wafer sizes.
Currently, many power devices are manufactured on 200 mm diameter silicon wafers; but to support increased demand, production is migrating to 300 mm wafers.
The solution leverages Lam’s industry-leading deep silicon etch capabilities and extends its suite of specialty technology offerings.
Specialty technologies refer to power devices, micro-electromechanical systems (MEMS), analog and mixed-signal semiconductors, radio frequency IC (RF) solutions, optoelectronic devices, and CMOS image sensors (CIS).
These specialty technologies based devices, sensors and circuits support a broad range of consumer and industrial technologies and applications, such as electric vehicles, the internet of things (IoT) and 5G.
“Demand for specialty devices continues to grow rapidly,” said Pat Lord, EVP – Customer Support Business Group and Global Operations, Lam Research.
“Through close collaboration with our customers, we identified the need for an accelerated path to manufacturing advanced power devices using 300 mm wafers,” added Lord.
Syndion GP helps chipmakers meet the growing demand while supporting the continuous innovation of new specialty technology breakthroughs, according to Lord.
Syndion GP expands Lam’s extensive deep silicon etch portfolio that includes the 200 mm DSiE platform and 300 mm Syndion GS for packaging, hybrid memory, and CMOS image sensor markets.
The solution offers the flexibility in meeting both the precision control and improved productivity for high volume manufacturing processes